High-frequency module and communication apparatus
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United States of America Patent
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Oct 30, 2007
Grant Date -
May 19, 2005
app pub date -
Oct 7, 2004
filing date -
Oct 8, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.
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