Method and apparatus for forming multi-layered circuits using liquid crystalline polymers
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United States of America Patent
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Nov 6, 2007
Grant Date -
Jan 25, 2007
app pub date -
Jul 22, 2005
filing date -
Jul 22, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus for producing high layer count, multi-layer circuits which includes fabricating a fixture having an opening therein for placement within a press. A material stack, particularly a material stack having multiple layers of liquid crystalline polymer, is placed within the opening of the fixture before activating the press to laminate the material stack positioned within the fixture.
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