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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HEWLETT-PACKARD DEVELOPMENT COMPANY L P	10300 ENERGY DR SPRING TX 77389

International Classification(s)

• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
McClelland, Paul	Monmouth, OR	13	233
Nelson, Curt Lee	Corvallis, OR	6	3907
Nyholm, Peter S	Austin, TX	11	79
Thirukkovalur, Niranjan	Corvallis, OR	15	136

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
November 06, 2007	US,7291380,B2   US7291380B2	GRANTED PATENT AS SECOND PUBLICATION
January 12, 2006	US,20060008627,A1   US20060008627A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7291380

Laser enhanced plating for forming wiring patterns

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