Method to form topography in a deposited layer above a substrate
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United States of America Patent
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-
Nov 6, 2007
Grant Date -
Jun 14, 2007
app pub date -
Dec 9, 2005
filing date -
Dec 9, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the present invention a dummy structure is formed in a first deposited layer in order to create topography, generally a raised area, in a deposited layer formed above and later than the first deposited layer. This topography may be advantageous in later steps. In one embodiment, transferred topography allows an alignment or overlay mark obscured by an opaque layer to be located by this enhanced topography. In another embodiment, a raised volume of dielectric material prevents features at the outside of an array area from being overpolished during a CMP step. This method may prove useful in other contexts as well. The size, shape, and placement of the dummy structure is tailored to form the desired excess volume.
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