Stack package and fabricating method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 6, 2007
Grant Date -
Aug 5, 2004
app pub date -
Dec 29, 2003
filing date -
Dec 31, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed are a stack package and a fabricating method thereof using a ball grid array semiconductor package (hereinafter, referred to as 'BGA PKG'). The stack package can easily electrically connect the stacked BGA PKGs with each other by simplifying a stack structure between the BGA PKGs, and increase bonding reliability by improving bonding force bonded portions of solder balls of substrates.
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