Transmission-line spring structure

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United States of America Patent

PATENT NO 7293996
APP PUB NO 20060286832A1
SERIAL NO

11463283

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Abstract

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A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are etched to form an elongated spring structure, and then one end of the spring structure is released from the underlying substrate, causing the tip of the released end to bend away from the substrate for contact with a second device. One or both of the conductive layers is fabricated using self-bending spring metals to facilitate the bending process, and plated metal is utilized for conductivity. Alternatively, or in addition, the dielectric layer is formed using a stress-engineered dielectric material. Two-tip and three-tip structures are used to facilitate connection of both the ground and signal lines.

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Patent Owner(s)

Patent OwnerAddress
PALO ALTO RESEARCH CENTER INCORPORATEDWEBSTER NY 14580

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chua, Christopher L San Jose, CA 168 3015
Fork, David K Los Altos, CA 160 4014
Van, Schuylenbergh Koenraad F Sunnyvale, CA 31 636

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