Microstructure array and a microlens array
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United States of America Patent
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-
Nov 13, 2007
Grant Date -
Feb 10, 2005
app pub date -
Sep 1, 2004
filing date -
Apr 1, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a method of fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electroplating or electrodeposition. A second plated layer is further formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroless plating to reduce a size distribution of microstructures over the array.
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