Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 13, 2007
Issued Date -
N/A
app pub date -
Mar 7, 2005
filing date -
Mar 8, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A starting point for cleavage made up of at least one of a groove and a through hole is formed on a chip dividing line or a dicing line along the cleaved surface of a wafer. Liquid matter is injected into the starting point. Then, the liquid matter is changed by applying an external factor that changes the liquid matter physically. Making use of the change, the wafer is cleaved so as to divide the wafer into semiconductor chips.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully