Solder ball pad structure
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United States of America Patent
Stats
-
Nov 13, 2007
Grant Date -
Jul 7, 2005
app pub date -
Dec 30, 2003
filing date -
Dec 30, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The inner portion of the contact pad includes a compliant layer and a conductive layer that is disposed over the compliant layer. The inner portion of the contact pad has sufficient flexibility to distribute mechanical stress applied to the contact pad and can mitigate damage to the interconnect structure.
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