Apparatus and methods for constructing antennas using wire bonds as radiating elements
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United States of America Patent
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Nov 13, 2007
Grant Date -
Feb 9, 2006
app pub date -
Aug 6, 2004
filing date -
Aug 6, 2004
priority date (Note) -
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Abstract
Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
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