Image sensor package structure and image sensing module
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United States of America Patent
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-
Nov 20, 2007
Grant Date -
N/A
app pub date -
Aug 15, 2006
filing date -
Aug 15, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.
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