Damped package for piezoelectric devices
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United States of America Patent
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Nov 20, 2007
Grant Date -
N/A
app pub date -
Sep 25, 2006
filing date -
Sep 25, 2006
priority date (Note) -
Expired
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Abstract
A packaging system for piezoelectric devices is provided that substantially reduces and avoids the deleterious effects of environmental vibrations and shocks with gas or fluid-filled chambers that drastically improve the resonator's ability to withstand unwanted disturbances and decrease or eliminate the attendant frequency shifts. The damped piezoelectric resonator packaging system combines a resonator package, a membrane and gas/fluid-filled chambers that dampen dynamic amplification of the resonator and firmly restrain the resonator within the packaging system. The selection of gas or fluid for the chamber depends upon variables such as the type of waves being propagated and interaction with the piezoelectric substrate.
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