CMP diamond conditioning disk
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United States of America Patent
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Nov 27, 2007
Grant Date -
Mar 22, 2007
app pub date -
Aug 23, 2006
filing date -
Sep 22, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.
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