Semiconductor device and method for manufacturing the same
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United States of America Patent
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Dec 4, 2007
Grant Date -
Jul 1, 2004
app pub date -
Dec 16, 2003
filing date -
Dec 26, 2002
priority date (Note) -
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Abstract
It is an object of the present invention to provide a technique for making a semiconductor device thinner without using a back-grinding method for a silicon wafer. According to the present invention, an integrated circuit film is mounted, thereby making a semiconductor device mounting the integrated circuit film thinner. The term 'an integrated circuit film' means a film-like integrated circuit which is manufactured based on an integrated circuit manufactured by a semiconductor film formed over a substrate such as a glass substrate or a quartz substrate. In the present invention, the integrated circuit film is manufactured by a technique for transferring.
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