Microelectronic assemblies with springs
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 4, 2007
Grant Date -
Feb 24, 2005
app pub date -
Jul 28, 2004
filing date -
Jul 30, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully