Fluid-containing cooling plate for an electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7306027
APP PUB NO 20060000579A1
SERIAL NO

10883450

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A fluid-containing cooling plate includes a bottom plate, a top plate, and metal wire or tubing formed into a circuit and sandwiched between the plates to form a chamber. The wire is plated or otherwise coated with a brazeable or solderable alloy which bonds it to the plates when the assembly is heated, thereby sealing the chamber. To make a two-phase cooling plate, slugs of plated metal are placed in the chamber and are bonded to the plates to provide support against collapse. The chamber is provided with a wicking structure, and is partially filled with an evaporable fluid via an inlet. A partial vacuum is then drawn, and the inlet is closed off. To make a single-phase cooling plate, wire partitions serving as baffles are provided in lieu of the slugs. These partitions can be arranged to provide a serpentine flow path between the inlet and an outlet, and are likewise plated with an alloy which melts to bond them to the plates.

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Patent Owner(s)

Patent OwnerAddress
ANTARES CAPITAL LP AS SUCCESSOR AGENT500 WEST MONROE STREET CHICAGO IL 60661

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cennamo, John R Gilford, NH 5 93
Cook, Randolph H Gilford, NH 10 106
Kang, Sukhvinder S Rochester, MN 20 336
Whitney, Bradley R Boscawen, NH 8 72

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