Three dimensional polymer memory cell systems
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United States of America Patent
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Dec 11, 2007
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N/A
app pub date -
Jul 26, 2004
filing date -
Jul 26, 2004
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Abstract
Systems and methodologies are provided for forming three dimensional memory structures that are fabricated from blocks of individual polymer memory cells stacked on top of each other. Such a polymer memory structure can be formed on top of control component circuitries employed for programming a plurality of memory cells that form the stacked three dimensional structure. Such an arrangement provides for an efficient placement of polymer memory cell on a wafer surface, and increases amount of die space available for circuit design.
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