Integrated circuit chip bonding sheet and integrated circuit package
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United States of America Patent
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-
Dec 11, 2007
Grant Date -
Jan 30, 2003
app pub date -
Jun 19, 2002
filing date -
Jun 20, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.
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