Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 11, 2007
Grant Date -
Aug 16, 2007
app pub date -
Apr 20, 2007
filing date -
Jan 17, 1997
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention is a semiconductor device capable of relieving thermal stress without breaking wire. It comprises a semiconductor chip (12), a solder ball (20) for external connection, wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relieving layer (16) provided on the semiconductor chip (12), and a stress transmission portion (22) for transmitting stress from the solder ball (20) to the stress relieving layer (16) in a peripheral position of an electrical connection portion (24a) of the solder ball (20) and wiring (18).
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