Arrangement with conductive pad embedment

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United States of America Patent

PATENT NO 7307437
SERIAL NO

11089379

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plurality of conductive pads of an apparatus in one example are disposed on a circuit board in a predetermined arrangement compatible with an arrangement of probes on an external test connector. One or more of the plurality of conductive pads is disposed on an embedded layer of the circuit board.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP11445 COMPAQ CENTER DRIVE WEST HOUSTON TX 77070

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhagwath, Nitin Lincoln, CA 3 25
Chheda, Sachin Navin Roseville, CA 18 312
Dobbs, Robert Granite Bay, CA 18 151

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