Wafer inspection system
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United States of America Patent
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Dec 11, 2007
Grant Date -
Dec 2, 2004
app pub date -
Feb 3, 2004
filing date -
Feb 3, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method and system for identifying a defect or contamination on a surface of a material. The method and system involves providing a material, such as a semiconductor wafer, using a non-vibrating contact potential difference sensor to scan the wafer, generate contact potential difference data and processing that data to identify a pattern characteristic of the defect or contamination.
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