Diffusion bonded nickel-copper powder metallurgy powder
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United States of America Patent
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Dec 18, 2007
Grant Date -
Oct 5, 2006
app pub date -
Apr 4, 2005
filing date -
Apr 4, 2005
priority date (Note) -
Expired
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Abstract
In contrast to current industrial practice where alloying powders are added to starting powder metallurgy compositions either as powder mixtures or fully prealloyed powders, the present invention posits a diffusion bonded nickel-copper precursor additive mixture for direct one step addition to the starting powder metallurgy master blend composition. Segregation and dusting are substantially reduced and the mechanical properties of the resultant compact are improved.
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