US Patent No: 7,309,914

Number of patents in Portfolio can not be more than 2000

Inverted CSP stacking system and method

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Abstract

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Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TAMIRAS PER PTE. LTD., LLCALVISO, CA561

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goodwin, Paul Austin, TX 51 1074

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
Micron Technology, Inc. (4)
* 7,915,077 Methods of making metal core foldover package structures 1 2008
* 2008/0299,709 METAL CORE FOLDOVER PACKAGE STRUCTURES 6 2008
* 8,115,112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates 6 2008
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UNISEMICON CO. LTD. (1)
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SAMSUNG ELECTRONICS CO., LTD. (1)
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* Cited By Examiner

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