Inverted CSP stacking system and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7309914
APP PUB NO 20060157842A1
SERIAL NO

11039615

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TAMIRAS PER PTE. LTD., LLCDOVER, DE296

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goodwin, Paul Austin, TX 51 1126

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
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* Cited By Examiner

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