US Patent No: 7,309,914

Number of patents in Portfolio can not be more than 2000

Inverted CSP stacking system and method

ALSO PUBLISHED AS: 20060157842

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

Loading the Abstract Image... loading....

First Claim

See full text

all claims..

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
OVID DATA CO. LLCWILMINGTON, DE132

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goodwin, Paul Austin, TX 78 852

Cited Art Landscape

Patent Info (Count) # Cites Year
 
OVID DATA CO. LLC (31)
5,484,959 High density lead-on-package fabrication method and apparatus 129 1992
5,455,740 Bus communication system for stacked high density integrated circuit packages 81 1994
5,572,065 Hermetically sealed ceramic integrated circuit heat dissipating package 96 1994
5,592,364 High density integrated circuit module with complex electrical interconnect rails 41 1995
5,804,870 Hermetically sealed integrated circuit lead-on package configuration 69 1995
5,612,570 Chip stack and method of making same 178 1995
5,479,318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends 71 1995
5,493,476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends 51 1995
5,801,437 Three-dimensional warp-resistant integrated circuit module method and apparatus 83 1995
5,654,877 Lead-on-chip integrated circuit apparatus 81 1995
5,541,812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame 49 1995
5,778,522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 51 1996
5,828,125 Ultra-high density warp-resistant memory module 62 1996
5,783,464 Method of forming a hermetically sealed circuit lead-on package 55 1997
5,869,353 Modular panel stacking process 133 1997
6,205,654 Method of manufacturing a surface mount package 83 1998
6,310,392 Stacked micro ball grid array packages 48 1998
6,323,060 Stackable flex circuit IC package and method of making same 111 1999
6,288,907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 60 1999
6,262,895 Stackable chip package with flex carrier 157 2000
6,351,029 Stackable flex circuit chip package and method of making same 71 2000
6,360,433 Universal package and method of forming the same 64 2000
6,919,626 High density integrated circuit module 71 2001
6,473,308 Stackable chip package with flex carrier 86 2001
6,426,240 Stackable flex circuit chip package and method of making same 75 2001
6,514,793 Stackable flex circuit IC package and method of making same 66 2001
6,627,984 Chip stack with differing chip package types 77 2001
6,576,992 Chip scale stacking system and method 100 2001
6,572,387 Flexible circuit connector for stacked chip module 72 2002
6,908,792 Chip stack with differing chip package types 53 2002
6,914,324 Memory expansion and chip scale stacking system and method 73 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (16)
4,884,237 Stacked double density memory module using industry standard memory chips 173 1989
5,159,535 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate 113 1989
5,099,393 Electronic package for high density applications 135 1991
5,138,430 High performance versatile thermally enhanced IC chip mounting 141 1991
5,252,857 Stacked DCA memory chips 239 1991
5,198,965 Free form packaging of specific functions within a computer system 80 1991
5,241,454 Mutlilayered flexible circuit package 125 1992
5,243,133 Ceramic chip carrier with lead frame or edge clip 57 1992
5,229,916 Chip edge interconnect overlay element 119 1992
5,313,097 High density memory module 132 1992
5,523,619 High density memory structure 132 1993
5,502,333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit 198 1994
6,336,262 Process of forming a capacitor with multi-level interconnection technology 72 1997
5,926,369 Vertically integrated multi-chip circuit package with heat-sink support 108 1998
6,178,093 Information handling system with circuit assembly having holes filled with filler material 81 1998
6,444,490 Micro-flex technology in semiconductor packages 41 2001
 
SAMSUNG ELECTRONICS CO., LTD. (14)
5,594,275 J-leaded semiconductor package having a plurality of stacked ball grid array packages 143 1994
5,677,569 Semiconductor multi-package stack 126 1995
5,744,827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements 171 1996
5,841,721 Multi-block erase and verification circuit in a nonvolatile semiconductor memory device and a method thereof 83 1997
6,849,949 Thin stacked package 45 2000
6,452,826 Memory module system 112 2001
6,768,660 Multi-chip memory devices and modules including independent control of memory chips 67 2001
6,614,664 Memory module having series-connected printed circuit boards 76 2001
6,781,240 Semiconductor package with semiconductor chips stacked therein and method of making the package 39 2002
6,891,729 Memory module 33 2002
6,876,074 Stack package using flexible double wiring substrate 60 2002
6,812,567 Semiconductor package and package stack made thereof 38 2003
2005/0040,508 Area array type package stack and manufacturing method thereof 41 2004
2005/0133,897 Stack package with improved heat radiation and module having the stack package mounted thereon 68 2004
 
MICRON TECHNOLOGY, INC. (9)
5,012,323 Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe 261 1989
5,138,434 Packaging for semiconductor logic devices 238 1991
5,214,307 Lead frame for semiconductor devices having improved adhesive bond line control 89 1991
6,303,981 Semiconductor package having stacked dice and leadframes and method of fabrication 255 1999
6,552,910 Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture 166 2000
6,265,660 Package stack via bottom leaded plastic (BLP) packaging 78 2000
6,884,653 Folded interposer 80 2001
6,560,117 Packaged microelectronic die assemblies and methods of manufacture 173 2001
6,709,893 Interconnections for a semiconductor device and method for forming same 45 2001
 
TESSERA, INC. (8)
6,121,676 Stacked microelectronic assembly and method therefor 181 1997
6,225,688 Stacked microelectronic assembly and method therefor 197 1999
6,465,893 Stacked chip assembly 111 2000
2004/0075,991 Vapor phase connection techniques 39 2003
2004/0217,471 Component and assemblies with ends offset downwardly 39 2004
2004/0245,617 Dense multichip module 54 2004
2004/0217,461 Microelectronic adaptors, assemblies and methods 38 2004
2005/0035,440 Stacked chip assembly with stiffening layer 50 2004
 
ROUND ROCK RESEARCH, LLC (7)
6,097,087 Semiconductor package including flex circuit, interconnects and dense array external contacts 320 1997
6,028,365 Integrated circuit package and method of fabrication 275 1998
5,899,705 Stacked leads-over chip multi-chip module 109 1998
6,072,233 Stackable ball grid array package 316 1998
6,368,896 Method of wafer level chip scale packaging 151 1999
6,165,817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections 47 1999
6,465,877 Semiconductor package including flex circuit, interconnects and dense array external contacts 121 2000
 
STAKTEK GROUP L.P. (7)
5,279,029 Ultra high density integrated circuit packages method 308 1993
5,475,920 Method of assembling ultra high density integrated circuit packages 55 1994
5,543,664 Ultra high density integrated circuit package 73 1995
5,499,160 High density integrated circuit module with snap-on rail assemblies 62 1995
5,644,161 Ultra-high density warp-resistant memory module 92 1995
5,631,193 High density lead-on-package fabrication method 76 1995
5,588,205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails 49 1995
 
FREESCALE SEMICONDUCTOR, INC. (6)
5,222,014 Three-dimensional multi-chip pad array carrier 438 1992
5,247,423 Stacking three dimensional leadless multi-chip module and method for making the same 176 1992
5,239,198 Overmolded semiconductor device having solder ball and edge lead connective structure 315 1992
5,386,341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 163 1993
5,789,815 Three dimensional semiconductor package having flexible appendages 104 1996
6,040,624 Semiconductor device package and method 96 1997
 
ENTORIAN TECHNOLOGIES INC. (5)
5,420,751 Ultra high density modular integrated circuit package 107 1993
5,446,620 Ultra high density integrated circuit packages 73 1993
5,561,591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package 52 1994
5,566,051 Ultra high density integrated circuit packages method and apparatus 77 1994
6,025,642 Ultra high density integrated circuit packages 51 1997
 
APROLASE DEVELOPMENT CO., LLC (4)
4,983,533 High-density electronic modules - process and product 214 1987
5,104,820 Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting 256 1991
6,014,316 IC stack utilizing BGA contacts 113 1998
6,028,352 IC stack utilizing secondary leadframes 106 1998
 
FUJITSU LIMITED (4)
5,801,439 Semiconductor device and semiconductor device unit for a stack arrangement 108 1997
6,187,652 Method of fabrication of multiple-layer high density substrate 78 1998
6,444,921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like 106 2000
6,690,584 Information-processing device having a crossbar-board connected to back panels on different sides 78 2001
 
INTEL CORPORATION (4)
5,168,926 Heat sink design integrating interface material 85 1991
5,375,041 Ra-tab array bump tab tape based I.C. package 96 1992
6,233,650 Using FET switches for large memory arrays 133 1998
6,600,222 Stacked microelectronic packages 159 2002
 
KABUSHIKI KAISHA TOSHIBA (4)
5,394,010 Semiconductor assembly having laminated semiconductor devices 95 1992
5,394,303 Semiconductor device 238 1993
6,492,718 Stacked semiconductor device and semiconductor system 105 2000
6,528,870 Semiconductor device having a plurality of stacked wiring boards 84 2001
 
NEC CORPORATION (4)
5,240,588 Method for electroplating the lead pins of a semiconductor device pin grid array package 67 1992
5,805,422 Semiconductor package with flexible board and method of fabricating the same 139 1997
5,973,392 Stacked carrier three-dimensional memory module and semiconductor device using the same 81 1998
5,895,970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package 53 1998
 
RAMBUS INC. (4)
6,002,589 Integrated circuit package for coupling to a printed circuit board 77 1997
6,234,820 Method and apparatus for joining printed circuit boards 92 1997
6,449,159 Semiconductor module with imbedded heat spreader 108 2000
6,833,984 Semiconductor module with serial bus connection to multiple dies 104 2002
 
TEXAS INSTRUMENTS INCORPORATED (4)
4,712,129 Integrated circuit device with textured bar cover 47 1985
5,402,006 Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound 63 1992
6,285,560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified 63 1999
6,489,178 Method of fabricating a molded package for micromechanical devices 69 2001
 
AMP Incorporated (3)
4,587,596 High density mother/daughter circuit board connector 102 1984
4,696,525 Socket for stacking integrated circuit packages 104 1985
5,259,770 Impedance controlled elastomeric connector 88 1992
 
HITACHI, LTD. (3)
4,758,875 Resin encapsulated semiconductor device 60 1981
5,159,434 Semiconductor device having a particular chip pad structure 60 1991
6,034,878 Source-clock-synchronized memory system and memory unit 242 1997
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
5,252,855 Lead frame having an anodic oxide film coating 60 1991
5,835,988 Packed semiconductor device with wrap around external leads 362 1996
6,084,294 Semiconductor device comprising stacked semiconductor elements 79 1999
 
SEIKO EPSON CORPORATION (3)
6,486,544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument 100 2000
6,677,670 Semiconductor device 69 2001
6,489,687 Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment 101 2001
 
SONY CORPORATION (3)
5,343,075 Composite stacked semiconductor device with contact plates 105 1992
6,462,412 Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates 80 2001
2001/0040,793 Electronic device and method of producing the same 85 2001
 
URENSCHI ASSETS LIMITED LIABILITY COMPANY (3)
5,953,215 Apparatus and method for improving computer memory speed and capacity 178 1998
6,266,252 Apparatus and method for terminating a computer memory bus 115 1999
6,446,158 Memory system using FET switches to select memory banks 126 2000
 
FAIRCHILD SPACE AND DEFENSE CORPORATION (2)
5,646,446 Three-dimensional flexible assembly of integrated circuits 172 1995
5,776,797 Three-dimensional flexible assembly of integrated circuits 183 1997
 
GENERAL MOTORS CORPORATION (2)
4,398,235 Vertical integrated circuit package integration 91 1980
4,722,691 Header assembly for a printed circuit board 61 1986
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (2)
5,158,912 Integral heatsink semiconductor package 53 1991
6,588,095 Method of processing a device by electrophoresis coating 53 2001
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (2)
6,153,928 Substrate for semiconductor package, fabrication method thereof, and stacked-type semiconductor package using the substrate 30 1997
6,316,825 Chip stack package utilizing a connecting hole to improve electrical connection between leadframes 83 1999
 
LSI LOGIC CORPORATION (2)
5,262,927 Partially-molded, PCB chip carrier package 80 1992
5,729,894 Method of assembling ball bump grid array semiconductor packages 106 1996
 
MOTOROLA, INC. (2)
5,041,902 Molded electronic package with compression structures 254 1989
5,438,224 Integrated circuit package having a face-to-face IC chip arrangement 179 1993
 
RENESAS ELECTRONICS CORPORATION (2)
5,357,478 Semiconductor integrated circuit device including a plurality of cell array blocks 72 1991
5,219,794 Semiconductor integrated circuit device and method of fabricating same 102 1992
 
SGS-THOMSON MICROELECTRONICS S.R.L. (2)
5,034,350 Semiconductor device package with dies mounted on both sides of the central pad of a metal frame 90 1990
5,763,296 Method for fabricating an electronic device structure with studs locating lead frame on backing plate 35 1994
 
ADVANCED MICRO DEVICES, INC. (1)
5,068,708 Ground plane for plastic encapsulated integrated circuit die packages 89 1989
 
AMERASIA INTERNATIONAL TECHNOLOGY, INC. (1)
6,376,769 High-density electronic package, and method for making same 234 2000
 
AMKOR TECHNOLOGY, INC. (1)
6,683,377 Multi-stacked memory package 89 2000
 
ANAREN MICROWAVE, INC. (1)
4,821,007 Strip line circuit component and method of manufacture 158 1987
 
Bell Telephone Laboratories, Incorporated (1)
4,288,841 Double cavity semiconductor chip carrier 245 1979
 
Beta Phase, Inc. (1)
4,911,643 High density and high signal integrity connector 104 1989
 
Bridge Semiconductor Corporation (1)
6,803,651 Optoelectronic semiconductor package device 31 2002
 
Cal Flex, Inc. (1)
5,041,015 Electrical jumper assembly 111 1990
 
DAI-ICHI SEIKO CO., LTD. (1)
4,823,234 Semiconductor device and its manufacture 164 1986
 
Data General Corporation (1)
4,513,368 Digital data processing system having object-based logical memory addressing and self-structuring modular memory 68 1981
 
Dell USA, L.P. (1)
5,261,068 Dual path memory retrieval system for an interleaved dynamic RAM memory unit 127 1990
 
DPAC TECHNOLOGIES, INC. (1)
6,660,561 Method of assembling a stackable integrated circuit chip 65 2002
 
EASTMAN KODAK COMPANY (1)
5,917,709 Multiple circuit board assembly having an interconnect mechanism that includes a flex connector 95 1997
 
ENTORIAN TECHNOLOGIES L.P. (1)
5,377,077 Ultra high density integrated circuit packages method and apparatus 97 1993
 
FUJIFILM CORPORATION (1)
5,361,228 IC memory card system having a common data and address bus 47 1993
 
FUJITSU MICROELECTRONICS LIMITED (1)
5,081,067 Ceramic package type semiconductor device and method of assembling the same 88 1991
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,433,418 Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism 108 1999
 
GAITHER TOOL COMPANY, INC. (1)
6,222,737 Universal package and method of forming the same 77 1999
 
GENERAL ELECTRIC COMPANY (1)
5,657,537 Method for fabricating a stack of two dimensional circuit modules 70 1995
 
GLOBALFOUNDRIES INC. (1)
6,707,684 Method and apparatus for direct connection between two integrated circuits via a connector 42 2001
 
HENKEL AG & CO. KGAA (1)
6,620,651 Adhesive wafers for die attach application 59 2001
 
HITACHI CABLE, LTD. (1)
6,002,167 Semiconductor device having lead on chip structure 109 1996
 
HITACHI TOHBU SEMICONDUCTOR, LTD. (1)
5,198,888 Semiconductor stacked device 190 1990
 
HITACHI ULSI SYSTEMS CO., LTD. (1)
6,426,560 Semiconductor device and memory module 92 2000
 
Honeywell Bull Inc. (1)
4,891,789 Surface mounted multilayer memory printed circuit board 95 1988
 
Honeywell Information Systems Inc. (1)
4,437,235 Integrated circuit package 131 1982
 
HONEYWELL INTERNATIONAL INC. (1)
6,657,134 Stacked ball grid array 42 2001
 
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (1)
6,590,282 Stacked semiconductor package formed on a substrate and method for fabrication 85 2002
 
INSTITUTE OF MICROELECTRONICS (1)
5,925,934 Low cost and highly reliable chip-sized package 124 1996
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
5,289,062 Fast transmission gate switch 75 1993
 
INTERSIL CORPORATION (1)
5,117,282 Stacked configuration for integrated circuit devices 147 1990
 
IQ SYSTEMS, INC. (1)
5,922,061 Methods and apparatus for implementing high speed data communications 31 1996
 
LEGACY ELECTRONICS, INC. (1)
6,313,998 Circuit board assembly having a three dimensional array of integrated circuit packages 60 1999
 
LOCKHEED MARTIN CORPORATION (1)
6,410,857 Signal cross-over interconnect for a double-sided circuit card assembly 76 2001
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
4,645,944 MOS register for selecting among various data inputs 79 1984
 
MICRO CO., LTD. (1)
4,733,461 Method of stacking printed circuit boards 148 1986
 
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION (1)
5,057,903 Thermal heat sink encapsulated integrated circuit 81 1990
 
MINOLTA CO., LTD. (1)
5,764,497 Circuit board connection method and connection structure 86 1996
 
NANOPIERCE TECHNOLOGIES, INC. (1)
5,642,055 Electrical interconnect using particle enhanced joining of metal surfaces 82 1995
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
4,839,717 Ceramic package for high frequency semiconductor devices 111 1988
 
NCR CORPORATION (1)
4,953,060 Stackable integrated circuit chip package with improved heat removal 158 1989
 
NEC ELECTRONICS CORPORATION (1)
4,985,703 Analog multiplexer 81 1989
 
Netlist, Inc. (1)
2005/0018,495 ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE 97 2004
 
NGK INSULATORS, LTD. (1)
5,122,862 Ceramic lid for sealing semiconductor element and method of manufacturing the same 54 1990
 
NITTO DENKO CORPORATION (1)
6,208,521 Film carrier and laminate type mounting structure using same 203 1998
 
NORTHFIELD ACQUISITION CO. (1)
5,428,190 Rigid-flex board with anisotropic interconnect and method of manufacture 154 1993
 
OKI ELECTRIC INDUSTRY CO., LTD. (1)
6,084,293 Stacked semiconductor device 49 1998
 
OKI SEMICONDUCTOR CO., LTD. (1)
6,329,708 Micro ball grid array semiconductor device and semiconductor module 51 2000
 
PAC TECH - PACKAGING TECHNOLOGIES GMBH (1)
6,281,577 Chips arranged in plurality of planes and electrically connected to one another 174 1997
 
PARKER HANNIFIN CUSTOMER SUPPORT INC. (1)
6,426,549 Stackable flex circuit IC package and method of making same 73 2000
 
PS4 LUXCO S.A.R.L. (1)
6,157,541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements 106 1998
 
RAYTHEON COMPANY (1)
5,311,401 Stacked chip assembly and manufacturing method therefor 121 1991
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
6,300,679 Flexible substrate for packaging a semiconductor component 137 1998
 
SHARP KABUSHIKI KAISHA (1)
5,995,370 Heat-sinking arrangement for circuit elements 90 1998
 
SIEMENS AKTIENGESELLSCHAFT (1)
6,262,476 Composite member composed of at least two integrated circuits and method for the manufacture of a composite member composed of at least two integrated circuits 60 1999
 
SILICON GRAPHICS INTERNATIONAL, CORP. (1)
6,172,874 System for stacking of integrated circuit packages 102 1998
 
SILICON VALLEY BANK (1)
5,477,082 Bi-planar multi-chip module 220 1994
 
SIMPLETECH, INC. (1)
5,514,907 Apparatus for stacking semiconductor chips 170 1995
 
Storage Technology Corporation (1)
5,448,511 Memory stack with an integrated interconnect and mounting structure 223 1994
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
5,064,782 Method of adhesively and hermetically sealing a semiconductor package lid by scrubbing 42 1990
 
SUN MICROSYSTEMS, INC. (1)
5,963,427 Multi-chip module with flexible circuit board 81 1997
 
TALON RESEARCH, LLC (1)
5,347,428 Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip 255 1992
 
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC. (1)
5,276,418 Flexible substrate electronic assembly 83 1991
 
Tessers, Inc. (1)
6,699,730 Stacked microelectronic assembly and method therefor 120 2001
 
THOMAS & BETTS CORPORATION (1)
4,406,508 Dual-in-line package assembly 58 1981
 
TROVE TECHNOLOGY INCORPORATED, 7752 STEFFENSEN DRIVE, SALT LAKE CITY, UT 84121 A CORP. OF UT (1)
4,833,568 Three-dimensional circuit component assembly and method corresponding thereto 173 1988
 
TTA WIRELESS TRANSFER CO., LLC (1)
5,959,839 Apparatus for heat removal using a flexible backplane 75 1997
 
TWILIGHT TECHNOLOGY, INC. (1)
4,956,694 Integrated circuit chip stacking 299 1988
 
U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (1)
5,224,023 Foldable electronic assembly module 155 1992
 
VLSI TECHNOLOGY, INC. (1)
5,523,695 Universal test socket for exposing the active surface of an integrated circuit in a die-down package 77 1994
 
XOC Devices, Inc. (1)
4,862,249 Packaging system for stacking integrated circuits 192 1987
 
YAMAICHI ELECTRONICS CO., LTD. (1)
5,973,395 IC package having a single wiring sheet with a lead pattern disposed thereon 72 1997
 
Other [Check patent profile for assignment information] (10)
4,763,188 Packaging system for multiple semiconductor devices 201 1987
5,016,138 Three dimensional integrated circuit package 301 1989
5,281,852 Semiconductor device including stacked die 163 1991
5,397,916 Semiconductor device including stacked die 134 1993
5,751,553 Thin multichip module including a connector frame socket having first and second apertures 135 1995
2001/0013,423 FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER 103 1997
5,949,657 Bottom or top jumpered foldable electronic assembly 108 1998
6,392,162 Double-sided flexible jumper assembly and method of manufacture 64 2000
2002/0006,032 Low-profile registered DIMM 71 2001
6,509,639 Three-dimensional stacked semiconductor package 87 2002

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (2)
7,915,077 Methods of making metal core foldover package structures 0 2008
8,115,112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates 1 2008
 
SAMSUNG ELECTRONICS CO., LTD. (1)
8,588,017 Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same 0 2011

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jun 18, 2015
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 18, 2019
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00

Full Text

 
loading....