US Patent No: 7,309,914

Number of patents in Portfolio can not be more than 2000

Inverted CSP stacking system and method

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ALSO PUBLISHED AS: 20060157842
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
OVID DATA CO. LLCWILMINGTON, DE132

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goodwin, Paul Austin, TX 67 688

Cited Art

Patent Info (Count) # Cites Year
 
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6,323,060 Stackable flex circuit IC package and method of making same 111 1999
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6,262,895 Stackable chip package with flex carrier 153 2000
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OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (10)
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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (2)
7,915,077 Methods of making metal core foldover package structures 0 2008
8,115,112 Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates 1 2008

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