Stacked module systems and methods
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United States of America Patent
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Dec 18, 2007
Issued Date -
N/A
app pub date -
Oct 25, 2005
filing date -
Oct 26, 2001
priority date (Note) -
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Abstract
The present invention provides methods for constructing stacked circuit modules and precursor assemblies with flexible circuitry. Using the methods of the present invention, a single set of flexible circuitry whether articulated as one or two flex circuits may be employed with CSP devices of a variety of configurations either with or without form standards.
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