Method for assembling a ball grid array package with two substrates
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United States of America Patent
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Dec 25, 2007
Grant Date -
Aug 11, 2005
app pub date -
Mar 11, 2005
filing date -
Mar 21, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
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