Electronic component with flexible contacting pads and method for producing the electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 25, 2007
Grant Date -
Jun 16, 2005
app pub date -
Oct 12, 2004
filing date -
Mar 31, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic component has an electronic circuit and a rubber-elastic elevation. The rubber-elastic elevation is formed of an insulating rubber-elastic material disposed on a surface of the electronic component and has a conductive land on its crest. The rubber-elastic elevation also has on its sloping side or in its volume a conduction path between the land and the electronic circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully