Inkjet printhead assembly with an ink distribution molding
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United States of America Patent
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-
Jan 1, 2008
Grant Date -
Mar 1, 2007
app pub date -
Nov 3, 2006
filing date -
Mar 6, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printhead assembly includes a printhead which, in turn, includes a molding. The molding defines a recess in which an integrated circuit (IC) configured to eject ink can be received. The molding defines a quartet of separate ink passages each in fluid communication with the IC. An elongate support member supports the printhead and defines a quartet of separate ink reservoirs each in fluid communication with a respective ink passage. The support member includes a core element which defines the ink reservoirs and a metal shell in which the core can be received.
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