System and method for actively cooling transducer assembly electronics
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United States of America Patent
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-
Jan 1, 2008
Grant Date -
Apr 7, 2005
app pub date -
Mar 15, 2004
filing date -
Jun 27, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An ultrasound transducer assembly is disclosed having a housing, a transducer array mounted in the housing and an electronics assembly mounted in the housing, the electronics assembly including one or more sub-assemblies having heat generating components disposed thereon. The electronics sub-assemblies further include thermal conducting features which conduct heat generated by the heat generating components out of the electronics assembly where it can be further removed by other thermal management techniques. These other thermal management techniques may include techniques utilized to cool the transducer array.
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