Wafer-level processing of chip-packaging compositions including bis-maleimides
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United States of America Patent
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Jan 1, 2008
Grant Date -
Jul 5, 2007
app pub date -
Dec 30, 2005
filing date -
Dec 30, 2005
priority date (Note) -
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Abstract
A process of packaging a microelectronic chip includes wafer-level application of a chip-packaging composition that includes a polymer of a bis-maleimide. A process includes wafer-level addition of the chip-packaging compositions that include adding particulate fillers to achieve a coefficient of thermal expansion of about 20 ppm/K. A computing system is also included that uses a microelectronic die that was processed with the bis-maleimide at the wafer level, before singulation.
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