Surface-mounted electronic component module and method for manufacturing the same
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United States of America Patent
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-
Jan 1, 2008
Grant Date -
Mar 4, 2004
app pub date -
Jul 9, 2003
filing date -
Aug 29, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
More compact, thinner, shorter and lighter surface-mounted electronic component modules and their manufacturing methods at low costs, thus making them industrially highly valuable are available. Such the component includes a wiring substrate having wiring patterns formed on one side and external connection terminals formed on the other side, the wiring patterns and the external connection terminals being connected with each other by via holes or through holes; a plurality of electronic component devices mounted on the one side of the wiring substrate; and an exterior resin layer formed on the wiring substrate which covers the plurality of electronic component devices, wherein at least one of the plurality of electronic component devices is fastened face up to the one side of the wiring substrate, the connection terminal of the electronic component device fastened face up and the wiring pattern or the connection terminal of another electronic component device being connected with each other by wire.
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