Memory module having memory chips protected from excessive heat
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United States of America Patent
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Jan 8, 2008
Grant Date -
Mar 9, 2006
app pub date -
Aug 25, 2005
filing date -
Aug 25, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the memory chips and for communicating with a system that is external to the memory module, the buffer chip being arranged in a second region of the printed circuit board and being contact-connected by the printed circuit board; wherein the first and second regions of the printed circuit board are essentially thermally decoupled from one another.
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