Semiconductor chip assembly with precision-formed metal pillar
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United States of America Patent
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Jan 15, 2008
Grant Date -
N/A
app pub date -
May 26, 2005
filing date -
Oct 13, 2000
priority date (Note) -
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Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal pillar includes tapered sidewalls with first and second sidewall portions and a spike, and the first and second sidewall portions are concave arcs that are adjacent to one another at the spike.
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