US Patent No: 7,320,930
Number of patents in Portfolio can not be more than 2000
Multi-elevation singulation of device laminates in wafer scale and substrate processing
Stats
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Jan 22, 2008
Issued date -
Apr 19, 2004
filing date -
10/828,110
serial no -
In Force
status
Importance
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Abstract
Wafer scale and substrate processing device singulation methods, and devices made by the methods, for singulation of discrete devices from a processed wafer or laminated structures, involves formation of separation scribes or saw cuts at multiple elevations in intersecting scribe streets or lines so that a separation cut in one direction is at a different depth than a separation cut in a different and intersecting direction. Separation or fracture of the wafer or laminated structure along one of the separation cuts does not transfer to the separation line of the intersecting separation cut due to the difference in depth of the intersecting cuts or scribes, and due to the difference in elevation of the bottom surfaces of the cuts or scribes within the scribe streets, resulting in cleaner edges on the separated devices.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 2002/0114,507 Saw alignment technique for array device singulation | 3 | 2001 | |
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| 5,832,601 Method of making temporary connections between electronic components | 188 | 1997 | |
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| 6,150,240 Method and apparatus for singulating semiconductor devices | 21 | 1998 | |
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| 5,059,899 Semiconductor dies and wafers and methods for making | 164 | 1990 | |
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| 5,963,289 Asymmetrical scribe and separation method of manufacturing liquid crystal devices on silicon wafers | 49 | 1997 | |
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| 6,568,384 Semiconductor material cutting and processing method | 8 | 2000 | |
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| 6,422,227 Dicing apparatus, kerf inspecting method and kerf inspecting system | 7 | 2000 | |
Patent Citation Ranking
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