Thin film fuse phase change RAM and manufacturing method
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United States of America Patent
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Jan 22, 2008
Grant Date -
Dec 21, 2006
app pub date -
Jun 17, 2005
filing date -
Jun 17, 2005
priority date (Note) -
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Abstract
A memory device comprising a first electrode having a top side, a second electrode having a top side and an insulating member between the first electrode and the second electrode. The insulating member has a thickness between the first and second electrodes near the top side of the first electrode and the top side of the second electrode. A bridge of memory material crosses the insulating member, and defines an inter-electrode path between the first and second electrodes across the insulating member. An array of such memory cells is provided. In the array, a plurality of electrode members and insulating members therebetween comprise an electrode layer on an integrated circuit. The bridges of memory material have sub-lithographic dimensions.
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