Film bulk acoustic resonator and method for manufacturing the same
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United States of America Patent
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-
Jan 22, 2008
Grant Date -
Jun 30, 2005
app pub date -
Jul 15, 2004
filing date -
Dec 25, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A film bulk acoustic resonator, includes first to fourth insulator patterns disposed apart from each other. The third and fourth insulator patterns are disposed opposite the second and first insulator patterns in relation to the first and second insulating patterns, respectively. A bottom conductive layer is disposed above the first and third insulator patterns spreading from a region between the first and second insulator patterns to the third insulator pattern. A piezoelectric film is provided on the bottom conductive layer, disposed above the region between the first and second insulating patterns. A top conductive layer is facing the bottom conductive layer so as to sandwich the piezoelectric film, spreading from the region between the first and second insulator patterns to the fourth insulator pattern.
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