Microelectronic devices and methods for packaging microelectronic devices
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United States of America Patent
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Jan 22, 2008
Grant Date -
Nov 17, 2005
app pub date -
Jul 22, 2005
filing date -
Sep 18, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Microelectronic devices and methods of packaging microelectronic devices are disclosed herein. In one embodiment, a method includes placing a plurality of singulated radiation responsive dies on a support member, electrically connecting circuitry of the radiation responsive dies to contacts of the support member, and forming a barrier on the support member between adjacent radiation responsive dies without an adhesive attaching the barrier to the support member. The barrier is formed on the support member after electrically connecting the circuitry of the dies to the contacts of the support member. The barrier can encapsulate at least a portion of the wire-bonds.
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