Apparatus for fluid pressure imprint lithography
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United States of America Patent
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Jan 29, 2008
Grant Date -
Jul 7, 2005
app pub date -
Aug 25, 2004
filing date -
Jul 18, 2000
priority date (Note) -
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Abstract
Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.
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