Apparatus and methods for plasma vapor deposition processes

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United States of America Patent

PATENT NO 7323231
APP PUB NO 20050087130A1
SERIAL NO

10683606

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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One aspect of the invention is directed toward a method of forming a conductive layer on a microfeature workpiece. In one embodiment, the method comprises placing a microfeature workpiece in a vapor reaction chamber, depositing an electrically conductive material onto the microfeature workpiece in a vapor deposition process by flowing a gas into a plasma zone of the vapor deposition chamber and transmitting energy into the plasma zone via a transmitting window. The energy transmitted through the window and into the plasma zone produces plasma from the gas. The plasma produced from the gas forms a conductive layer on the workpiece and a residual film on the window. This embodiment of the method further includes changing the residual film on the window to have a reduced transmissivity to the energy.

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Patent Owner(s)

Patent OwnerAddress
U S BANK NATIONAL ASSOCIATION AS COLLATERAL AGENT100 WALL STREET SUITE 1600 NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Derderian, Garo J Boise, ID 185 9730

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