Semiconductor device
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United States of America Patent
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-
Jan 29, 2008
Grant Date -
Nov 17, 2005
app pub date -
Mar 16, 2005
filing date -
May 17, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes a semiconductor chip. A stepped member having stepped regions is provided on the semiconductor chip. The stepped member, together with a redistribution layer, is encapsulated by an encapsulating resin layer. The stepped member is exemplified by functional bumps and dummy bumps having stepped regions. The dummy bumps are electrically unconnected to the exterior, but are electrically connected to the redistribution layer.
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