System and method for resumed probing of a wafer
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United States of America Patent
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Jan 29, 2008
Grant Date -
Apr 12, 2007
app pub date -
Oct 19, 2006
filing date -
Jun 10, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.
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