Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same
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United States of America Patent
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-
Feb 5, 2008
Grant Date -
Apr 21, 2005
app pub date -
Dec 2, 2004
filing date -
Jan 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An adapter and method for aligning and connecting the external leads of at least one integrated circuit device to conductors on a substrate of a multi-chip module. The adapter includes a component frame configured to receive the integrated circuit device. The component frame is attached to a support member. The support member with attached component frame is placed over one side of the multi-chip module substrate and the external leads of the integrated circuit device are aligned with corresponding conductors on the multi-chip module substrate. A second support member, which may also have a component frame attached thereto, is placed over the opposing side of the multi-chip module substrate. The ends of the first support member are attached to the ends of the second support member such that the external leads of the IC device are forced into electrical contact with the corresponding conductors on the multi-chip module substrate.
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