US Patent No: 7,327,004

Number of patents in Portfolio can not be more than 2000

Sensor device

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Importance

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Abstract

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A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DENSO CORPORATIONKARIYA-CITY AICHI-PREF9971

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Ryuichiro Ichinomiya, JP 9 49
Hattori, Koji Tokyo, JP 35 179
Sakai, Minekazu Kariya, JP 72 993
Yamauchi, Shigenori Nisshin, JP 29 510
Yoneyama, Takao Anpachi-gun, JP 14 206

Cited Art Landscape

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (1)
* 6,522,015 Micromachine stacked wirebonded package 22 2000
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,316,840 Semiconductor device 70 2000
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
* 7,009,302 Micromachine package and method for manufacturing the same 8 2004
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
SEIKO EPSON CORPORATION (1)
* 8,624,339 Vibrating device and electronic apparatus 0 2012
 
STATS CHIPPAC PTE. LTE. (2)
* 7,989,941 Integrated circuit package system with support structure for die overhang 3 2008
* 2009/0236,751 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG 0 2008
 
DENSO CORPORATION (8)
* 7,615,832 Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip 1 2007
* 7,540,199 Physical quantity sensor 9 2007
* 8,156,804 Capacitive semiconductor sensor 2 2007
* 2008/0093,740 Capacitive semiconductor sensor 3 2007
7,762,134 Dynamic quantity sensor 6 2007
* 2008/0066,546 Dynamic quantity sensor 5 2007
7,950,288 Physical quantity sensor 1 2009
* 2009/0229,370 Physical quantity sensor 8 2009
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 9,018,029 Vent hole sealing in multiple die sensor device 1 2013
 
INFINEON TECHNOLOGIES AG (3)
* 7,557,417 Module comprising a semiconductor chip comprising a movable element 3 2007
* 2008/0197,485 Module comprising a semiconductor chip comprising a movable element 4 2007
* 9,346,667 Lead frame based MEMS sensor structure 0 2014
* Cited By Examiner

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