US Patent No: 7,327,004

Number of patents in Portfolio can not be more than 2000

Sensor device

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ALSO PUBLISHED AS: 20060097331
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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A sensor device includes a sensor chip having a movable portion on one surface, a circuit chip laminated with the sensor chip to be opposite to the movable portion of the sensor chip, and a bump located between the sensor chip and the circuit chip. In the sensor device, the sensor chip and the circuit chip are electrically connected through the bump, and the movable portion of the sensor chip is separated from the circuit chip by a space using the bump. Accordingly, it can effectively restrict parasitic capacity of an electric connecting portion between both the chips from being changed by an impact. For example, the sensor device can be used as an angular velocity sensor device having a vibrator as the movable portion.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DENSO CORPORATIONKARIYA-CITY AICHI-PREF10114

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Ryuichiro Ichinomiya, JP 16 14
Hattori, Koji Tokyo, JP 56 105
Sakai, Minekazu Kariya, JP 100 823
Yamauchi, Shigenori Nisshin, JP 33 460
Yoneyama, Takao Anpachi-gun, JP 16 165

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
7,009,302 Micromachine package and method for manufacturing the same 8 2004
 
AMKOR TECHNOLOGY, INC. (1)
6,522,015 Micromachine stacked wirebonded package 20 2000
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,316,840 Semiconductor device 61 2000

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
DENSO CORPORATION (5)
7,615,832 Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip 1 2007
7,540,199 Physical quantity sensor 7 2007
8,156,804 Capacitive semiconductor sensor 1 2007
7,762,134 Dynamic quantity sensor 5 2007
7,950,288 Physical quantity sensor 1 2009
 
INFINEON TECHNOLOGIES AG (1)
7,557,417 Module comprising a semiconductor chip comprising a movable element 2 2007
 
SEIKO EPSON CORPORATION (1)
8,624,339 Vibrating device and electronic apparatus 0 2012
 
STATS CHIPPAC LTD. (1)
7,989,941 Integrated circuit package system with support structure for die overhang 2 2008

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7.5 Year Payment $3600.00 $1800.00 $900.00 Aug 5, 2015
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 5, 2019
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Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00