Electronic package with optimized lamination process
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United States of America Patent
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Feb 12, 2008
Grant Date -
Oct 13, 2005
app pub date -
Jun 8, 2005
filing date -
Jul 2, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic package and method of formation. A thermally conductive layer having first and second opposing surfaces is provided. A first dielectric layer is laminated under pressurization to the first opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T.sub.1MIN and a maximum temperature T.sub.1MAX. T.sub.1MAX constrains the ductility of the first dielectric layer to be at least D.sub.1 following the laminating. T.sub.1MAX depends on D.sub.1 and on a first dielectric material comprised by the first dielectric layer. A second dielectric layer is laminated under pressurization to the second opposing surface of the thermally conductive layer, at a temperature between a minimum temperature T.sub.2MIN and a maximum temperature T.sub.2MAX. T.sub.2MAX constrains the ductility of the second dielectric layer to be at least D.sub.2 following the laminating. T.sub.2MAX depends on D.sub.2 and on a second dielectric material comprised by the second dielectric layer.
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