Laser trimming of resistors
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United States of America Patent
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-
Feb 12, 2008
Grant Date -
Aug 4, 2005
app pub date -
Mar 29, 2005
filing date -
Nov 21, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.
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