Flip-chip adaptor package for bare die
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United States of America Patent
Stats
-
Feb 12, 2008
Grant Date -
Aug 4, 2005
app pub date -
Mar 1, 2005
filing date -
Dec 19, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
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