Localizing a temperature of a device for testing
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United States of America Patent
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Feb 12, 2008
Issued Date -
N/A
app pub date -
Mar 21, 2005
filing date -
Jun 14, 2004
priority date (Note) -
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Abstract
Wafers or other structures comprising a plurality of dies or devices are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface of the structure to modify a temperature of the structure and inducing a second heat flux through a local area of a surface of the structure, proximate the device under test, to modify the temperature the device under test.
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