Solder bumps formation using solder paste with shape retaining attribute

United States of America Patent

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Feb 19, 2008
Grant Date
Dec 29, 2005
app pub date
Jun 25, 2004
filing date
Jun 25, 2004

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Expired

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Abstract

Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.

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Patent Owner(s)

Patent Owner	Address
INTEL CORPORATION	2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

International Classification(s)

B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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Inventor Name	Address	# of filed Patents	Total Citations
Koning, Paul A	Chandler, AZ	55	808
Martin, Edward L	Chandler, AZ	27	313

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Solder bumps formation using solder paste with shape retaining attribute

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United States of America Patent

10877924

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PATENT NO	7331500
APP PUB NO	20050284920A1
SERIAL NO	10877924
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 19, 2008	US,7331500,B2 US7331500B2	GRANTED PATENT AS SECOND PUBLICATION
December 29, 2005	US,20050284920,A1 US20050284920A1	FIRST PUBLISHED PATENT APPLICATION

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10877924

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