Selective removal of dielectric materials and plating process using same
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United States of America Patent
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Feb 19, 2008
Grant Date -
Nov 4, 2004
app pub date -
May 28, 2004
filing date -
Feb 9, 1999
priority date (Note) -
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Abstract
A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.
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