Bondwire utilized for coulomb counting and safety circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 19, 2008
Grant Date -
Nov 9, 2006
app pub date -
Sep 2, 2005
filing date -
May 6, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sense resistor and integrated circuit package combination is disclosed. A package lead frame is provided having a plurality of landing zones associated therewith and a die mounting area for mounting of a die thereon. The die has a plurality of bond pads associated therewith, with a first bond wire connected between a first one of the landing zones and a second one of the landing zones. The first bond wire forms a sense resistor with a resistance of a known value. A second bond wire is connected between the first one of the landing zones and a first one of the bond pads.
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