Stacked die in die BGA package
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United States of America Patent
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-
Feb 19, 2008
Grant Date -
Aug 7, 2003
app pub date -
Feb 5, 2002
filing date -
Jan 9, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Semiconductor devices and stacked die assemblies, are provided which have at least two semiconductor dies disposed on a substrate in a stacked arrangement, the first and second dies having first surfaces having bond pads, the second die having a second surface with a recessed edge portion along a perimeter of that die, and the recessed edge portion having a height sufficient for clearance of bonding elements extending from the first die.
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